Flux: chemical solvents for cleaning metal surfaces to be welded area. It can remove stains on the surface of the metal, it conducive welding.

IR reflow: A high-volume surface mount component soldering methods. It uses infrared heat radiation heating and melting the solder paste on the PCB and components.

PCB: printed circuit board.

Surface mount components (SMD): can be installed directly in the electronic components of the printed circuit board surface. Its pin is directly welded to a copper foil of the PCB pads (and components located on the PCB of the same side), no PCB opening fixed. For surface mount switch products, usually marked with suitable surface mount pin way (such as Jbend, L-Bend, butt, etc.), or marked suitable for surface mount soldering (IR reflow) and clean technology.

Surface Mount Technology (SMT): see SMD.

Washable: can withstand cleaning after the soldering process and maintain the electronic and mechanical performance of the same components used in mounted on a printed circuit board. The switch sealing process to ensure no foreign objects are not contaminate the contact area.

Wave soldering: A boiled by using the molten solder wave, the welding process to weld thereon by the insertion element on PCB.